When dealing with circuit boards, there are many times when the ball grid array needs to be reworked or replaced in order to complete the circuitry. Doing this process often requires an extensive amount of time, but not because it is difficult to replace, but more because it is necessary to keep all solder out of the way of the other components. By utilizing a few different tools and techniques, the process can be made much more efficient.
Although there are many different techniques that can be used to rework the ball grid array, one of the most successful is the use of Bga Stencils to complete the process. When replacing the mask that lays underneath the BGA, it is important to keep all solder from flowing down the rest of the circuit board. If the solder were to flow down through the vias it could potentially ruin the remainder of the circuitry. In order to prevent this and speed up the overall process of repair, a stencil can be utilized to keep the solder in place where it belongs underneath the BGA pads.
The Bga Stencils that can be purchased in order to increase the efficiency of rework are sized to fit perfectly under the pads and keep the solder in place. Through the use of adhesive, the stencil remains where it is pressed into place in the exact location of where the ball grid array should be located. By simply taping off the surrounding area and using solder paste to fill in the stencil, the reworking can be done much quicker than if the soldering was to be done by hand. Not only does this ensure the correct placement of the solder, but it also prevents the flow of solder into other areas of the circuit board.
Since it may be a common practice to rework the BGA on a circuit board, it is a process that should be done as efficiently as possible. Doing the process by hand is not always a viable option, especially when many reworking jobs are required. By utilizing the stencils, a larger number of reworks can be done that are both functional and precise.